I. Fundamentals of Conducted Emission Design.- 1. Designing for EMC.- 1.1 Noise (EMI).- 1.2 EMI Source, Path, and Victim.- 1.3 Conductive Paths.- 1.4 Conduction or Radiation?.- 1.5 Design to Control Conducted Emissions.- 2. EMI Spectrum.- 2.1 Time and Frequency Domains.- 2.2 Description of FFT Software.- 2.3 Data Interpretation.- 2.4 Bare Bones FFT.- 2.5 Methods of Inputting Data to FFT.- 2.6 An Enhanced Version of FFT.- 2.7 Examples of FFT Conversions from Time to Frequency Domains.- 2.8 Some Possible Pitfalls.- 2.9 Subharmonics.- 3. Capacitor Modeling.- 3.1 The Capacitor Model.- 3.2 Parasitic Elements of Capacitors.- 3.3 Capacitor Types.- 3.4 Capacitor Voltage Ratings.- 4. Inductor Modeling.- 4.1 Inductor Losses.- 4.2 Inductor Capacitance.- 4.3 Air Core with Conductor Near Experiment.- 4.4 Inductor Cores Form Capacitive Paths.- 4.5 Inductor Impedance Curve.- 4.6 Parasitic Elements of Inductors.- 4.7 Simulation.- 5. Balun Modeling.- 5.1 Differential Mode Flux.- 5.2 Common Mode Flux.- 5.3 The Truth about Windings on Inductor Cores.- 5.4 Coupling K Factor.- 5.5 Differential Balun Inductance.- 5.6 Common Mode Balun Inductance.- 5.7 Effects of Load and Source Resistances on Attenuation.- 5.8 Balun Driving Impedance.- 5.9 Balanced Circuits.- 5.10 Design Criteria.- 5.11 Model.- 6. Filters.- 6.1 Parasitic Inductances and Capacitances.- 6.2 Academic LC Filter.- 6.3 Simple Real World LC Filter.- 6.4 Control Parasitics by Design.- 6.5 Parasitics Caused by Circuit Layout.- 6.6 Filter Circuit Design.- 6.7 Characteristic Impedance of LC Filters.- 6.8 Parallel Capacitors to Lower the ESR.- 6.9 LC Filter.- 6.10 Line Impedance Stabilization Networks.- 6.11 Filter Layout and Packaging Design.- 7. Grounding Electronic Circuits.- 7.1 Grounding.- 7.2 Safety Grounds.- 7.3 Ground Geometries.- 7.4 Ground Design for Packaging ElectronicCircuitry.- 7.5 Shielding.- 8. EMI Analysis.- 8.1 EMI Modeling.- 8.2 EMI Analysis Using SPICE.- II. Advanced Conducted Emission Design.- 9. EMC Regulations.- 9.1 FCC.- 9.2 VDE.- 9.3 MIL-STD-461.- 9.4 Voltage/LISN Measurement Method.- 9.5 Current/Capacitor Measurement Method.- 9.6 A Comparison of Some of the RF Conducted Emissions Standards.- 10. Switch Mode Power Supplies.- 10.1 Typical Power Supply Block Diagram.- 10.2 Typical Switch Mode Power Supply EMI Problem Areas.- 10.3 EMI Simulation and Laboratory EMI Test Setup.- 10.4 SMPS EMI Design Example.- 10.5 Model the Problem.- 10.6 Simulation Problems.- 10.7 Back to Fundamental Model.- 10.8 Identify the Players.- 10.9 Other Types of EMI Modeling for SMPS.- 10.10 Conclusion.- 11. Transistor and Diode Packaging Problem for EMI.- 11.1 New Semiconductor Device Packages.- 11.2 Common Mode Shorting Screens.- 11.3 Typical System with Power Conversion.- 11.4 Common Mode Current Paths.- 11.5 Conducted Emissions Reduction by Choice of Package.- 12. Circuit Examples.- 12.1 Example 1.- 12.2 Example 2.- 12.3 Example 3 (FFT).- 13. Computers and Digital Logic Circuitry.- 13.1 Conducted Emissions Coupling Paths.- 13.2 Sequential Logic and Clocks.- 13.3 Example of Internal Conducted Emissions.- 13.4 What Is the Best Bypass Capacitor?.- 13.5 Power Entry Capacitor.- 14. What This Analysis Method Is Not.- 14.1 Diagnostics.- 14.2 Fields.- 14.3 Radiation.- 14.4 Characteristic Impedances of Common Pairs of Conductors.- 14.5 Shortcomings of EMI Test Simulation as Described Herein.- 15. Magnetic Saturation Modeling.- 15.1 The Polarization of Magnetic Domains.- 15.2 Device, Core, and Material Properties.- 15.3 Core Geometry Effects.- 15.4 Effects of Cores Made of Two Different Materials.- 15.5 Some Crucial Parameters to Model Saturation.- 15.6 Methods of Integrating Voltage.- 15.7 Dr. Lauritzen’s Saturation Model.- 15.8 The Core Geometry and Material Porosity Region of the B-H Loop.- 15.9 Curve Fitting versus Parametric Models.- 15.10 Conclusion.- Appendix. BASIC FFT.
