More than Moore Technologies for Next Generation Computer Design

Specificaties
Gebonden, 189 blz. | Engels
Springer New York | 2015e druk, 2015
ISBN13: 9781493921621
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Springer New York 2015e druk, 2015 9781493921621
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Samenvatting

This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.

Specificaties

ISBN13:9781493921621
Taal:Engels
Bindwijze:gebonden
Aantal pagina's:189
Uitgever:Springer New York
Druk:2015

Inhoudsopgave

Impact of TSV and Device Scaling on the Quality of 3D Ics.- 3D Integration Technology.- Design and Optimization of Spin-Transfer Torque MRAMs.- Embedded STT-MRAM: Device and Design.- A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis.- Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors.- Design Automation for On-chip Nanophotonic Integration.

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        More than Moore Technologies for Next Generation Computer Design