Gratis boekenweekgeschenk bij een bestelling boven de €17,50 (geldt alleen voor Nederlandstalige boeken)

Epoxy Adhesive Formulations

Specificaties
Gebonden, blz. | Engels
McGraw-Hill Education | e druk, 2005
ISBN13: 9780071455442
Rubricering
McGraw-Hill Education e druk, 2005 9780071455442
€ 268,37
Levertijd ongeveer 10 werkdagen

Samenvatting

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality,  authenticity, or access to any online entitlements included with the product.

Unmodified, epoxy resins cause certain problems for both the adhesive formulator and end-user. They are often rigid and brittle; hence, impact resistance and peel strength are poor. For decades, Chemist have been vigorously working to minimize these major shortcomings. Based on a popular course sponsored by the Society of Plastics Engineers and written by an authority in the field, this comprehensive text presents a variety of methods to accomplish what up to now has been a formidable task. Beginning with epoxy chemistry, moving on to fillers, filler treatments, and surfactants, and ending with current and future development in formulating Epoxy Adhesives, this rigorous text addressed the problem of improving flexibility, durability and strength by adding chemical groups to the epoxy structure either via the base resin or the curing agent or by adding separate flexibilizing resins to the formulation to create an epoxy-hybrid adhesive.

Specificaties

ISBN13:9780071455442
Taal:Engels
Bindwijze:gebonden

Inhoudsopgave

<H3>Chapter 1: Epoxy Adhesives<H3>Chapter 2: Epoxy Resin Chemistry<H3>Chapter 3: Important Properties of Epoxy Adhesives<H3>Chapter 4: Epoxy Resins<H3>Chapter 5: Epoxy Curing Agents and Catalysts<H3>Chapter 6: Solvents and Dilutents<H3>Chapter 7: Hybrid Resins<H3>Chapter 8: Flexibilizers and Tougheners<H3>Chapter 9: Fillers and Extenders<H3>Chapter 10: Adhesion Promoters and Primers<H3>Chapter 11: Room Temperature Curing Epoxy Adhesives<H3>Chapter 12: Elevated-Temperature Curing Liquid and Paste Epoxy Adhesives<H3>Chapter 13: Solid Epoxy Adhesive Systems<H3>Chapter 14: Unconventional Epoxy Adhesives<H3>Chapter 15: Effect of the Service Environment<H3>Chapter 16: Epoxy Adhesives on Selected Substrates<H3>Chapter 17: Processing of Epoxy Adhesives<H3>Chapter 18: Health and Safety Issues<H3>Chapter 19: Quality Control and Specification<H3>Chapter 20: Testing<H4>APPENDIX A: TRADE NAMES AND MANUFACTURERS: EPOXY ADHESIVES, EPOXY RESINS, CURING AGENTS AND CATALYSTS, ADDITIVES AND MODIFIERS<H4>APPENDIX B: PROPERTIES OF SELECTED COMMERCIAL EPOXY ADHESIVE FORMULATIONS<H4>APPENDIX C: SELECTED EPOXY RESINS<H4>APPENDIX D: EPOXY CURING AGENTS<H4>APPENDIX E: INDEX TO FORMULATIONS<H4>APPENDIX F: SURFACE PREPARATION METHODS FOR COMMON SUBSTRATE MATERIALS<H4>APPENDIX G: SPECIFICATIONS AND STANDARDS<H4>APPENDIX H: CONVERSION FACTORS<H4>INDEX
€ 268,37
Levertijd ongeveer 10 werkdagen

Rubrieken

    Personen

      Trefwoorden

        Epoxy Adhesive Formulations