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Sputtering by Particle Bombardment III

Characteristics of Sputtered Particles, Technical Applications

Specificaties
Paperback, 415 blz. | Engels
Springer Berlin Heidelberg | 0e druk, 2014
ISBN13: 9783662311042
Rubricering
Springer Berlin Heidelberg 0e druk, 2014 9783662311042
Onderdeel van serie Topics in Applied Physics
Verwachte levertijd ongeveer 9 werkdagen

Samenvatting

Sputtering, the ejection of atoms or groups of atoms from the surface of a solid bombarded by energetic particles, is a widely observed phenomenon that has many applications in today's experimental physics and technology. This is the third and final volume of a comprehensive review on sputtering. Whereas the first two volumes deal primarily with physical aspects such as the theory of sputtering, experimentally observed sputtering yields and surface topography changes, this volume is devoted to the characteristic properties of the sputtered particles and technological applications of sputtering. The particles are characterized by their energy, mass, and angular distributions, along with their charge and excitation states, while the applications described in- clude surface and depth analysis, micromachining, and the production of surface coatings and thin films. As in the previous two volumes, the various chapters have been written by the main authorities in the field. The book addresses a broad audience: scientists active in the field will find the overview and background information they have long been seeking, while students and new comers to surface science and materials science will find a readable introduction to sputtering.

Specificaties

ISBN13:9783662311042
Taal:Engels
Bindwijze:paperback
Aantal pagina's:415
Uitgever:Springer Berlin Heidelberg
Druk:0

Inhoudsopgave

Angular, energy, and mass distribution of sputtered particles.- Charged and excited states of sputtered atoms.- Surface and depth analysis based on sputtering.- Desorption of organic molecules from solid and liquid surfaces induced by particle impact.- Production of microstructures by ion beam sputtering.- Production of thin films by controlled deposition of sputtered material.

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        Sputtering by Particle Bombardment III