M.R. Oliver
Springer Berlin Heidelberg
2004e druk, 2004
9783540431817
Chemical-Mechanical Planarization of Semiconductor Materials
Specificaties
Gebonden, 428 blz.
|
Engels
Springer Berlin Heidelberg |
2004e druk, 2004
ISBN13: 9783540431817
Rubricering
Onderdeel van serie
Springer Series in Materials Science
Verwachte levertijd ongeveer 9 werkdagen
Samenvatting
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Specificaties
ISBN13:9783540431817
Taal:Engels
Bindwijze:gebonden
Aantal pagina's:428
Uitgever:Springer Berlin Heidelberg
Druk:2004
Inhoudsopgave
1 Introduction.- 2 CMP Technology.- 3 Metal Polishing Processes.- 4 Metal CMP Science.- 5 Equipment Used in CMP Processes.- 6 CMP Polishing Pads.- 7 Fundamentals of CMP Slurry.- 8 CMP Cleaning.- 9 Patterned Wafer Effects.- 10 Integration Issues of CMP.- Appendix: Pourbaix Diagrams.- References.