Marin Alexe,
Ulrich Gösele
Springer Berlin Heidelberg
2004e druk, 2004
9783540210498
Wafer Bonding
Applications and Technology
Specificaties
Gebonden, 504 blz.
|
Engels
Springer Berlin Heidelberg |
2004e druk, 2004
ISBN13: 9783540210498
Rubricering
Onderdeel van serie
Springer Series in Materials Science
Verwachte levertijd ongeveer 9 werkdagen
Samenvatting
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Specificaties
ISBN13:9783540210498
Taal:Engels
Bindwijze:gebonden
Aantal pagina's:504
Uitgever:Springer Berlin Heidelberg
Druk:2004
Inhoudsopgave
1 Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding.- 2 Basics of Silicon-on-Insulator (SOI) Technology.- 3 Silicon-on-Insulator by the Smart CutTM Process.- 4 ELTRAN® Technology Based on Wafer Bonding and Porous Silicon.- 5 Wafer Bonding for High-Performance Logic Applications.- 6 Application of Bonded Wafers to the Fabrication of Electronic Devices.- 7 Compound Semiconductor Heterostructures by Smart CutTM: SiC On Insulator, QUASICTM Substrates, InP and GaAs Heterostructures on Silicon.- 8 Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach.- 9 Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers.- 10 High-Density Hybrid Integration of III–V Compound Optoelectronics with Silicon Integrated Circuits.- 11 Layer Transfer by Bonding and Laser Lift-Off.- 12 Single-Crystal Lithium Niobate Films by Crystal Ion Slicing.- 13 Wafer Bonding of Ferroelectric Materials.- 14 Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications.