Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach

Specificaties
Gebonden, blz. | Engels
Springer International Publishing | e druk, 2018
ISBN13: 9783319757674
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Springer International Publishing e druk, 2018 9783319757674
Levertijd ongeveer 8 werkdagen

Samenvatting

This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design.  Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively.  Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.

Specificaties

ISBN13:9783319757674
Taal:Engels
Bindwijze:gebonden
Uitgever:Springer International Publishing

Inhoudsopgave

Introduction.- Wirebond Physical Implementation.-  Flip-Chip Physical Implementation.- Substrate Physical Implementation.- Conventional Design Flow.-  Pathfinding and Co-Design.

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        Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach