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Advanced Metallization Conference 2005 (AMC 2005): Volume 21

Specificaties
Gebonden, 782 blz. | Engels
Materials Research Society | e druk, 2006
ISBN13: 9781558998650
Rubricering
Materials Research Society e druk, 2006 9781558998650
Onderdeel van serie MRS Conference Proce
Verwachte levertijd ongeveer 9 werkdagen

Samenvatting

Technical leaders from around the world gather here to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, advanced packaging and vertical integration. Both current state-of-the-art and ongoing challenges associated with multilevel interconnect are addressed. Included are papers on the latest developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the understanding of means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Additional contributions discuss the design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices.

Specificaties

ISBN13:9781558998650
Taal:Engels
Bindwijze:Gebonden
Aantal pagina's:782
Uitgever:Materials Research Society

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        Advanced Metallization Conference 2005 (AMC 2005): Volume 21