Kazuo Kondo,
Rohan N. Akolkar,
Dale P. Barkey,
Masayuki Yokoi
e.a.
Springer New York
e druk, 2016
9781493953738
Copper Electrodeposition for Nanofabrication of Electronics Devices
Specificaties
Paperback, blz.
|
Engels
Springer New York |
e druk, 2016
ISBN13: 9781493953738
Rubricering
Onderdeel van serie
Nanostructure Science and Technology
Levertijd ongeveer 8 werkdagen
Samenvatting
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
Specificaties
ISBN13:9781493953738
Taal:Engels
Bindwijze:paperback
Uitgever:Springer New York
Inhoudsopgave
Copper Electrodeposition.- Suppression Effect and Additive Chemistry.- Acceleration Effect.- Modeling and Simulation.- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects.- Microstructure of Evolution of Copper in Nano-scale Interconnect Features.- Direct Copper Plating.- Through Silicon Via.- Build-up Printed Wiring Boards.- Copper Foil Smooth on Both Sides for Lithium Ion Battery.- Through Hole Plating.