Design for Advanced Manufacturing: Technologies and Processes

Introduction<br/>Part 1 Manufacturing with Lasers<br/>1.1 Overview of Laser Manufacturing Processes<br/>Reference<br/>1.2 Laser Cutting<br/>Materials<br/>Equipment Capabilities<br/>Design Considerations<br/>1.3 Laser Surface Texturing<br/>Process Physics<br/>Why Use Laser Texturing?<br/>Design Considerations<br/>Material Suitability<br/>Laser versus Electron Beam<br/>Continuous versus Pulsed Operation<br/>Surface Topography<br/>Polishing Limitations<br/>Structuring Limitations<br/>Cost<br/>References<br/>1.4 Laser Ablation for Cleaning, Decoating, and Surface Preparation<br/>Basic Science of Laser Ablation<br/>Surface Preparation in Manufacturing<br/>Implementation Considerations<br/>Applications Where Laser Ablation Works Best<br/>Applications Where Laser Ablation May or May Not Bring Important Benefits<br/>Manual versus Robotic Laser Ablation<br/>Precautions and Safety<br/>1.5 Laser Hardening<br/>Process<br/>Applicable Lasers<br/>Laser Hardening Materials<br/>Grain Size<br/>Hardening Process Comparisons<br/>Application Examples<br/>Laser Hardening of Dies and Tooling<br/>Laser Hardening of Gears<br/>Laser Hardening of Machine Parts<br/>Laser Hardening of Cast Iron<br/>References<br/>1.6 Laser Welding of Metals<br/>Applications<br/>Equipment<br/>Materials<br/>Design Considerations<br/>References<br/>1.7 Laser Welding of Plastics<br/>Contour Welding<br/>Simultaneous<br/>Quasi-Simultaneous<br/>Mask<br/>Line<br/>Unique Variations<br/>Applications<br/>Materials Selection<br/>Joint Design<br/>Design Considerations<br/>References<br/>1.8 Designing for Laser Soldering<br/>The Process<br/>Typical Characteristics and Applications<br/>Economics<br/>Suitable Materials<br/>Design Recommendations<br/>Through-Hole Pad Design<br/>Lap Joint Pad Design<br/>Connector Selection<br/>Fixturing<br/>Lead-to-Hole Ratio<br/>1.9 Design for Laser Cladding<br/>The Laser Cladding Process<br/>Laser Cladding and Conventional Welding<br/>Laser Cladding with Powder versus Wire<br/>Laser Cladding with Powder<br/>Laser Cladding with Wire<br/>Applications and Cladding Variables<br/>Filler Materials<br/>Laser Cladding Production Performance<br/>1.10 Laser Marking and Engraving<br/>Laser Marking<br/>Materials That Can Be Marked<br/>Selecting a Laser<br/>Marking Metals<br/>Anneal Marking<br/>Engraving and Etching<br/>Plastic, Glass, Coated, and Paper Marking<br/>Marking on Painted Surfaces<br/>1.11 Laser-Assisted Forming<br/>Laser Forming<br/>Laser-Assisted Forming<br/>Laser-Assisted Micro Forming<br/>References<br/>1.12 Laser Peening<br/>Laser Peening Process<br/>Typical Characteristics and Applications<br/>Residual Stress Magnitude and Depth<br/>Residual Stress Stability<br/>Surface Roughness Effects<br/>Material Properties<br/>Compensating Stresses and Deformation<br/>Common Applications<br/>Economics<br/>General Process Design Considerations<br/>Design Methodology<br/>Pattern Size and Location<br/>Intensity and Coverage<br/>Suitable Materials<br/>Detailed Design Considerations<br/>Variations Based on Supplier<br/>Intensity and Coverage Specification<br/>Patch Size and Location on Drawings<br/>Processing of Thin Sections and Shot Orders<br/>Minimum Thickness<br/>Part 2 Manufacturing with Additive Processes<br/>2.1 Overview of Additive Manufacturing Processes<br/>Overview of Primary Additive Manufacturing Technologies<br/>General Design Considerations for Additive Manufacturing<br/>References<br/>2.2 Binder Jetting<br/>The Process and Materials<br/>Typical Characteristics and Applications<br/>As Bonded<br/>Lightly Sintered<br/>Sintered and Infiltrated<br/>Highly Sintered<br/>Advantages of Binder Jetting<br/>Economics<br/>General Design Considerations<br/>Suitable Materials<br/>Detailed Design Considerations<br/>Wall Thickness<br/>Uniform Wall Thickness<br/>Inside Edges<br/>Interior Holes<br/>Part Connections<br/>2.3 Directed Energy Deposition<br/>Metals<br/>Applications<br/>Design Issues<br/>References<br/>2.4 Material Extrusion<br/>Applications<br/>Considerati