Embedded and Fan–Out Wafer and Panel Level Packagi ng Technologies for Advanced Application Spaces – High Performance Compute and System–in–Package

Name: Embedded and Fan–Out Wafer and Panel Level Packagi ng Technologies for Advanced Application Spaces – High Performance Compute and System–in–Package
Author: B Keser

High Performance Compute and System–in–Package

Specificaties

Gebonden, 320 blz. | Engels

John Wiley & Sons | e druk, 2022

ISBN13: 9781119793779

Rubricering

John Wiley & Sons e druk, 2022 9781119793779

Onderdeel van serie IEEE Press

161,01

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Verwachte levertijd ongeveer 8 werkdagen

Specificaties

ISBN13:9781119793779

Taal:Engels

Bindwijze:gebonden

Aantal pagina's:320

Uitgever:John Wiley & Sons

Serie:IEEE Press

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Embedded and Fan–Out Wafer and Panel Level Packagi ng Technologies for Advanced Application Spaces – High Performance Compute and System–in–Package

High Performance Compute and System–in–Package

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Embedded and Fan–Out Wafer and Panel Level Packagi ng Technologies for Advanced Application Spaces – High Performance Compute and System–in–Package

Embedded and Fan–Out Wafer and Panel Level Packagi ng Technologies for Advanced Application Spaces – High Performance Compute and System–in–Package

High Performance Compute and System–in–Package

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Embedded and Fan–Out Wafer and Panel Level Packagi ng Technologies for Advanced Application Spaces – High Performance Compute and System–in–Package

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Embedded and Fan–Out Wafer and Panel Level Packagi ng Technologies for Advanced Application Spaces – High Performance Compute and System–in–Package