Shen (Huazhong University of Science and Technology, Wuhan, Hubei, China) Liu,
Yong Liu
John Wiley & Sons Inc
e druk, 2011
9780470827802
Modeling and Simulation for Microelectronic Packaging Assembly
Manufacturing, Reliability and Testing
Specificaties
Gebonden, 576 blz.
|
EN
John Wiley & Sons Inc |
e druk, 2011
ISBN13: 9780470827802
Rubricering
Levertijd ongeveer 15 werkdagen
Samenvatting
An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.
Specificaties
ISBN13:9780470827802
Taal:EN
Bindwijze:Gebonden
Aantal pagina's:576
Uitgever:John Wiley & Sons Inc