Editor's Preface – newly written<br>Alphabetical List of Articles<br>An Introduction to Investigation and Characterization of Materials<br>Acoustic Microscopy <br>Adhesives: Tests for Mechanical Properties <br>Amorphous Materials: Electron Spin Resonance <br>Amorphous Materials: Nuclear Magnetic Resonance,<br>Amorphous Materials: Nuclear Spin Relaxation <br>Amorphous Materials: Small-Angle Scattering <br>Amorphous Materials: Vibrational Spectroscopy <br>Amorphous Materials: X-ray Absorption Spectroscopy <br>Analytical Transmission Electron Microscopy <br>Anodization Microscopy <br>Art Forgeries: Scientific Detection <br>Atomic Force Microscopy <br>Auger Electron Microscopy <br>Auger Microscopy: Angular Distribution <br>Brittle Materials: Strength Testing <br>Ceramics, Cathodoluminescence Analysis of <br>Ceramics: Fracture Toughness Testing <br>Ceramic Powders: Packing Characterization <br>Channelling-Enhanced Microanalysis <br>Chemical Analysis of Solid Surfaces <br>Combinatorial Screening <br>Composite Materials: Nondestructive Evaluation <br>Compton Scattering <br>Confocal Optical Microscopy <br>Corrosion and Oxidation Study Techniques <br>Corrosion: Test Methods <br>Crack Growth Measurement <br>Creep by Indentation <br>Creep, Creep Rupture and Stress Relaxation Testing<br>Creep-Fatigue Interaction Testing <br>Dating Archaeological Materials <br>Deep Level Transient Spectroscopy <br>Depth Profiling <br>Diffusion: Novel Measurement Methods <br>*Diffusion Multiple Screening: Phase Diagram Mapping and Related Studies <br>Dislocations: Experimental Observation <br>Elastic Modulus Measurement <br>Elastomers: Spectroscopic Characterization <br>Elastomers: Tests for Mechanical Properties <br>Electron Diffraction <br>Electron Diffraction, Low-Energy <br>Electron Energy Loss Spectrometry <br>Electron Microscope Analysis of Defect Clusters, Voids and Bubbles <br>Electron Microscopy, High-Voltage <br>Electron Spectroscopy for Chemical Analysis <br>Electron Spin Resonance <br>Electron Tunnelling Spectroscopy <br>Electronic Raman Spectroscopy <br>Ellipsometry EMSAT, p. 2755<br>Fatigue(Multiaxial) Testing <br>Fatigue Testing <br>Fatigue Testing: Thermal and Thermomechanical <br>Field-Ion Microscopy <br>Field-Ion Microscopy: Atom Probe Microanalysis <br>Field-Ion Microscopy: Observation of Radiation Effects <br>Fractal Analysis <br>Fracture of Polymeric Materials <br>Fracture Toughness Testing of Metallic Materials<br>Gamma Radiography <br>Gamma-Ray Diffraction <br>Gas and Liquid Chromatography <br>Grain-Boundary Geometry: Measurement <br>Grain-Size: Nondestructive Evaluation <br>Hardness Testing <br>High-Resolution Electron Micrsocopy <br>High-Resolution Electron Microscopy of Interfaces<br>Hydrogen as a Metallurgical Probe <br>Infrared Spectroscopy <br>Impact Testing <br>In-Reactor Creep Testing: Techniques <br>Ion Backscattering Analysis <br>Ion Chromatography <br>Junction Transient Spectroscopy <br>Kerr Microscopy <br>Laser Microprobe Mass Spectrometry <br>Laser Sampling Inductively Coupled Mass Spectrometry<br>Liquid Chromatography Mass Spectrometry <br>Luminescence Imaging of Ceramics <br>Low-Energy Electron Diffraction <br>Magnetic Force Microscopy <br>Magnetic Materials: Measurements <br>Magnetic Materials: Transmission Electron Microscopy <br>Magnetic Measurements: Pulse Field <br>Magnetic Measurements: Quasistatic and AC <br>Magnetic Recording Measurements <br>Magnetic Systems: De Haas van Alphen Studies of Fermi Surface <br>Magnetism: Applications of Synchrotron Radiation<br>Mechanical Properties Microprobe <br>Mechanical Testing at High Strain Rates <br>Mechanical Testing Methods of Fibers and Composites<br>Mechanical Testing of Ceramics <br>Mechanical Testing: Overview <br>Microengineering of Materials: Characterization <br>Microstructural Evolution: Computer Simulation <br>Microtextural Analysis <br>Mössbauer Spectrometry <br>Nanoindentation Techniques <br>Nanometer-Scale Evaluation of Advanced Materials by Using Positrons <br>Neutron Activation Analysis <br>Neutron Diffraction <br>Neutron Radiography <br>Neutron Reflectometry for the Study of Absorption from Solution at Solid Surfaces, <br>Nuclear Magnetic Resonance Spectroscopy <br>Optical Calorimetry <br>Optical Emission Spectroscopy <br>Optical Microscopy <br>Organic Mass Spectrometry <br>Oxide Surfaces by STM, Study of <br>Paper and Paperboard: Destructive Mechanical Testing <br>Paper and Paperboard: Nondestructive Evaluation <br>Paper Surfaces: Subjective Evaluation <br>Particle-Induced X-Ray Emission <br>Perturbed Angular Correlations (PAC) <br>Phase Diagrams and Phase Stability: Calculations<br>Photoelasticity <br>Photoelectron Diffraction <br>Pole Figures and Orientation Distribution Functions<br>Polymer Dielectric Properties: Test Methods <br>Polymers: Electron Micsocopy <br>Polymers: Light Microscopy <br>Polymers: Molecular Weight and its Distribution <br>Polymers: Neutron Scattering <br>Polymers: Raman Spectroscopy <br>Polymers: Tests for Degradation and Stabilisation<br>Polymers: Tests for Flammability <br>Polymers: Tests for Mechanical Properties <br>Polymers: Tests for Thermal Properties <br>Polymers: Thermal Analysis <br>Polymers: X-Ray Scattering <br>Porosity: Characterization and Investigation <br>Positron Annihilation Spectroscopy of Defects in Metals <br>Positron-Annihilation Techniques, Advanced, for Materials Research<br>Powder Characterization <br>Powder Mechanics <br>Raman Spectroscopy and Microscopy <br>Reflection Electron Microscopy Concise, p. 409<br>Residual Stresses: Measurement by Diffraction <br>Residual Stresses: Measurement by Raman Shift <br>Residual Stresses: Measurement using Magnetoelastic Effects <br>Residual Stresses: Measurement using Neutron Diffraction <br>Scanning Electron Microscopy <br>Scanning SQUID Microscope <br>Scanning Tunneling Microscopy and Spectroscopy <br>Secondary–Ion Mass Spectrometry <br>Semiconductor Materials: Characterization by Etching <br>Semiconducting Materials: Electron Microscopy <br>Semiconductors, Electrical Evaluation of <br>Semiconductors, Local Vibrational Mode Spectroscopy <br>Semiconductors, Raman Spectroscopy of <br>Semiconductors, Scanning Photoluminescence <br>Semicrystalline Polymers: Lamellar Morphology by SAXS <br>Single-Crystal X-Ray Diffraction <br>Small-Specimen Mechanical Testing <br>Solid-State Nuclear Track Detectors: Applications<br>Solid State: Study Using Muon Beams <br>Spark-Source Mass Spectrography <br>SQUIDS: Magnetic Microscopy EMSAT, p. 8787<br>SQUIDS: The Instrument <br>Stress Distribution: Analysis Using Thermoelastic Effect <br>Superconducting Materials: Measurements <br>Surface Chemistry: Electron Yield Spectroscopy <br>Surface Chemistry: EXAFS <br>Surface Evaluation by Atomic Force Microscopy <br>Surface Photochemistry <br>Thermal Transport Properties, Measurement of <br>Texture: Nondestructive Characterization <br>Thermal Analysis: An Overview <br>Thermal Analysis: More Recent Developments <br>Thermal Wave Imaging <br>Thermally Contracting Materials: Characterisation<br>Thermodynamic Activity: Measurement <br>Thermoluminescence <br>Thermophysical Measurements, Subsecond <br>Thin Films: Characterization by X-Rays <br>Thin Films: In-Situ Stress Measurement of <br>Thin Films: Mechanical Testing <br>Thin Films: Stress Measurement Techniques <br>Transmission Electron Microscopy <br>Vibrothermography <br>Viscoelasticity/Anelasticity <br>Wood: Acoustic Emission and Acousto-Ultrasonic Characteristics <br>X-Ray Absorption Spectroscopy: EXAFS and XANES Techniques <br>X-Ray and Neutron Diffraction Studies of Amorphous Solids <br>X-Ray and Neutron Diffuse Scattering of Radiation-Induced Defects <br>X-Ray Diffraction, Time-Resolved <br>X-Ray Fluorescence Spectrometry <br>X-Ray Microanalysis, Quantitative <br>X-Ray Diffraction <br>X-Ray Powder Diffraction <br>X-Ray Topography